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EIC-i.MX93-210 Multimedia Kit

eInfochips offers Multimedia Kit which interfaces with eInfochips EIC-i.MX93-210 development kit for quick prototyping of multimedia solutions. This kit supports connectivity of Audio IN/OUT, 5.5” 1080 x1920p (FHD) resolution display with touch screen support, 1.0MP MIPI Camera (RPi-CAM-MIPI) developed by NXP & M.2 Key E type connector. It interfaces with EIC-i.MX93-210 development kit through High-Speed Connectors (HS1 & HS2) and Low-Speed Interface connector.

Display Interface

  • Interface Type : 4 Lane MIPI DSI
  • LCD Type : IPS TFT (16.7M)/ Transmissive
  • Backlight Type : White LED (14*LED)
  • Display Resolution : 1080 x 1920 (Maximum)
  • Framerate supported : 60
  • Bit Per Pixel (BPP) : 24
  • Pixel stream type : Packed pixel stream, RGB888 (24 bits per pixels)
  • LCD-Active area – Outline dimensions (W x H) : 68.04mm(W) x 120.96mm(H)
  • Pixel pitch – 0.063mm x 0.063mm
  • System Interface
    • Display Data : 4 Lane MIPI DSI
    • Touch : I2C
    • Control : GPIOs
  • Mezzanine to Display Board Cable : 40 pins FFC Cable
  • Supply Voltages
    • Display : 2.8V for VCC, 1.8V for I/O
    • Touch : 3.3V for VCC, 1.8V IO
  • Operating Temperature : -20°C ~50°C

Audio Interfaces

  • 2x on board Analog Mic Input
  • 8-bit RGB Parallel interface to MX93-210 development kit
  • 2x 1W Speaker Out
  • 1x 3.5mm Audio Jack
  • 2x Digital PDM Mic input

Camera Interface

  • Provides connectivity of 1.0MP CSI camera module “RPI-CAM-MIPI” designed by NXP
  • 22-pin/0.5mm FPC/FFC connector interface to connect with “RPI-CAM-MIPI”

C2 Key-E Type connector support

  • Provide connectivity of M.2 Key E Type externa WLAN module
  • Supports multiple interfaces SDIO, PCM, UART, USB, I2C

Multimedia Kit Dimensions

  • 85mm x 54mm


System On Module

Carrier Board

Mezzanine Board







OS Support

Mechanical Specifications

Operating Environment

Electrical Specifications

Kit Details

Note :* This is preliminary information and subject to change without notice