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NXP i.MX93 : EIC-i.MX93-210
The EIC- i.MX93-210 is an RDP based on the i.MX93 application processors. The processor features a scalable Arm Ethos™-U65 microNPU Core for efficient machine learning acceleration, as well as advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to begin creating high-performance, cost-effective, and energy-efficient machine-learning applications. Wi-Fi, Bluetooth, Gigabit Ethernet, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card are all available. The kit includes pre-integrated Linux, making it an excellent choice for applications such as industrial automation, smart home & intelligent appliances, smart buildings, and automotive.
CPU
| CPU Name : NXP i.MX93 |
| CPU Type : Two Cortex®-A55 processors operating up to 1.7 GHz. |
MEMORY
| LPDDR4 : 1x 2GB LPDDR4x RAM |
| eMMC : 1x 16GB eMMC 5.1 |
| SDIO : 1x SDIO 3.0 interface (mux with WLAN) |
| Micro-SD card : 1x SD Card 3.0 interface |
CONNECTIVITY
Wi-Fi :
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Bluetooth :
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USB :
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Ethernet :
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DISPLAY
| DSI : 1x 4-Lane MIPI DSI v1.2 interface |
| LVDS : 1x 4-Lane LVDS |
| HDMI : 1x HDMI interface (Mux) |
CAMERA
| CSI : 2 Lane MIPI CSI-2 v1.2 interface |
| RGB : 8-bit RGB interface (Mux) |
AUDIO
CSI :
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SENSORS
| Sensors : 1x 4 channel current sensor |
OTHER
Other :
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POWER SPECIFICATIONS
| SOM : 3.8V to 5.5V (Typ. 5V) |
| Carrier (Kit) : 10.8V to 13.2V (Typ. 12V) |
MECHANICAL SPECIFICATIONS
| SOM : 65mm x 55mm |
| Carrier (Kit) : 85mm x 100mm |
OS SUPPORT
| OS : Linux |
CPU
System On Module
Carrier Board
Mezzanine Board
Memory
Multimedia
Display
Connectivity
Networking
Audio
OS Support
Mechanical Specifications
Operating Environment
Electrical Specifications
Kit Details
