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Talk to Expert for Custom Design

eInfochips 865: EIC-Q865-210

eInfochips 865: EIC-Q865-210
EIC-Q865-210-2
EIC-Q865-210-3
EIC-Q865-210-4
The eInfochips 865 hardware development kit (HDK) is based on Qualcomm® Snapdragon™ 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. The kit features Qualcomm® Snapdragon Elite Gaming™, Qualcomm® Sensing Hub Qualcomm® Artificial Intelligence Engine, Qualcomm® aptX™ Adaptive Audio and Qualcomm Aqstic™ Audio Technologies. The 865 HDK enables OEMs and engineers to evaluate performance of SM8250 for their next-gen products while minimizing design risk factors and reducing design cycle time with early time to market. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices including Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions.
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CPU

CPU Name : Qualcomm® Kryo™ 585 CPU
CPU Type : Qualcomm® Kyro™ 670, 64-bit applications processor
CPU Cores : 8
CPU Clock (Max) : 2.84 GHz

Memory

LPDDR4 : 6GB LPDDR5 PoP memory
UFS : 128GB UFS 3.0

Multimedia

2D/3D Graphics Acceleration : Qualcomm® Adreno™ 650 GPU
Video Encode : 

  • Video encode up to 4K120 or 8K30
  • Concurrent 4K60 decode and 4K30 encode for wireless display
Video Decode : 

  • Video decode up to 4K240 or 8K60
Camera Interfaces :

  • 4x 4-Lane MIPI CSI camera ports with separate I2C control busses on 160-pin expansion header for optional camera board
  • Support for 3D Camera Configuration
  • Additional 2x 4-Lane MIPI CSI camera ports available on high speed expansion header

Connectivity

SD : 1x microSD/UFS 2.1 Card Socket
USB : 2x USB 3.0 Type-A host via on-board hub
UART : 1x USB micro-B debug UART
PCI-E : 1x PCIe v3 2-lane to M.2 socket
JTAG : 1x JTAG
GPIO : Low speed GPIO expansion header

Networking

Wi-Fi :

  • Qualcomm® Wi-Fi (QCA6391)11a/b/g/n/ac/ax 2.4/5.0 GHz
  • 2×2 with MU-MIMO
Bluetooth : Bluetooth 5.1 + HS (backward compatible)

Audio

Audio :

  • Qualcomm® WCD9385 audio codec on-board
  • 1x Headset headphone output
  • 1x loud-speaker output
  • 1x Earpiece output
  • 2x Analog MIC input
  • 5x Digital MIC input

OS Support

Android : 10.0

Mechanical Specifications

Carrier Board Dimensions : 100mm x 85mm

Electrical Specifications

Supply voltage :

  • 12V/5A DC Main Supply (*Power supply not part of Kit content)
Digital I/O voltage : 1.8 V

Display

DSI : 

  • 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High Speed Display Connector
  • Optional Display/Expansion board mates to DSI connectors
  • HDMI 2.0 via MIPI DSI  up to 4K @ 60Hz
  • DisplayPort 1.4 over USB3.1 Gen 2 Type-C

CPU

 

CPU Name :                Qualcomm® Kryo™ 585 CPU
CPU Type : Qualcomm® Kyro™ 670, 64-bit applications processor
CPU Cores : 8
CPU Clock (Max) : 2.84 GHz

System On Module

Carrier Board

Mezzanine Board

Memory

LPDDR4 : 6GB LPDDR5 PoP memory

UFS : 128GB UFS 3.0

Multimedia

2D/3D Graphics Acceleration : Qualcomm® Adreno™ 650 GPU

Video Encode :

  • Video encode up to 4K120 or 8K30
  • Concurrent 4K60 decode and 4K30 encode for wireless display

Video Decode : Video decode up to 4K240 or 8K60

Camera Interfaces :

  • 4x 4-Lane MIPI CSI camera ports with separate I2C control busses on 160-pin expansion header for optional camera board
  • Support for 3D Camera Configuration
  • Additional 2x 4-Lane MIPI CSI camera ports available on high speed expansion header

Display

DSI :

  • 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High Speed Display Connector
  • Optional Display/Expansion board mates to DSI connectors
  • HDMI 2.0 via MIPI DSI  up to 4K @ 60Hz
  • DisplayPort 1.4 over USB3.1 Gen 2 Type-C

Connectivity

SD : 1x microSD/UFS 2.1 Card Socket

USB : 2x USB 3.0 Type-A host via on-board hub

UART : 1x USB micro-B debug UART

PCI-E : 1x PCIe v3 2-lane to M.2 socket

JTAG : 1x JTAG

GPIO : Low speed GPIO expansion header

Networking

Wi-Fi :

  • Qualcomm® Wi-Fi (QCA6391)11a/b/g/n/ac/ax 2.4/5.0 GHz
  • 2×2 with MU-MIMO

Bluetooth : Bluetooth 5.1 + HS (backward compatible)

Audio

Audio :

  • Qualcomm® WCD9385 audio codec on-board
  • 1x Headset headphone output
  • 1x loud-speaker output
  • 1x Earpiece output
  • 2x Analog MIC input
  • 5x Digital MIC input

OS Support

Android : 10.0

Mechanical Specifications

Dimensions (W x L) : 100 mm x 85 mm

Operating Environment

Electrical Specifications

Supply voltage : 12V/5A DC Main Supply (*Power supply not part of Kit content)

Digital I/O voltage : 1.8 V

Kit Details

Documentation

eInfochips 865 Technical Datasheet Download

eInfochips, an Arrow Electronics company, is a leading provider of digital transformation and product engineering services. eInfochips accelerates time to market for its customers with its expertise in IoT, AI/ML, security, sensors, silicon, wireless, cloud, and power. eInfochips has been recognized as a leader in Engineering R&D services by many top analysts and industry bodies, including Gartner, Zinnov, ISG, IDC, NASSCOM and others.

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– INDIA, Ahmedabad

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