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eInfochips 845 : EIC-Q845-210

eInfochips 845 : EIC-Q845-210
EIC-Q845-210-2
EIC-Q845-210-3
The eInfochips 845 hardware development kit (HDK) is based on Qualcomm® Snapdragon™ 845 processor that comes with high performance camera and graphics features. It integrates Adreno™ 630 Visual Processing Subsystem and Qualcomm Spectra™ 280 ISP for vivid graphics, crystal-clear audio and improved area awareness which make 845 HDK platform ideal for real-life experience solutions. The 845 HDK enables OEMs and engineers to evaluate performance of Snapdragon™ 845 for their next-gen products while minimizing design risk factors and reducing design cycle time with early time to market. This feature-rich Android 8 development platform is an ideal starting point for integration and innovation of connected devices including Virtual cinema, 3D gaming, High-end camera, AR/VR, and 4K video solutions. Note: The LCD display is an add-on accessory and not part of the standard kit.
Get A Quote Download Datasheet

CPU

CPU Name : Qualcomm Snapdragon™ SDA845
CPU Type : Kryo™ 385
CPU Cores : 8
CPU Clock (Max) : 2.80 GHz

Memory

LPDDR4 : 6GB
UFS : UFS 2.1, 128GB

Multimedia

2D/3D Graphics Acceleration : Adreno™ 630 GPU
Video Encode : 

  • Video Capture to 4K (3840×2160) Ultra HD at 60fps
  • HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
Video Decode : 

  • Video Playback to 4K (3840×2160) Ultra HD at 60fps
  • H.264 (AVC), H.265 (HEVC), VP9
Camera Interfaces : 

  • 2x 16MP(@30fps ZSL) or 1x 32MP (@30fps ZSL) camera
  • 3x 4-lane + 1x 2-lane MIPI CSI ports

Display

DSI : 

  • HDMI 1.4 via DSI -> HDMI bridge on board
  • Display Port over USB3.1 Type-C
HDMI : 

  • HDMI 1.4 via 1X4 lane MIPI DSI;
  • HDMI bridge on board

Networking

Wi-Fi : 

  • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz, 2×2 MIMO
  • WiGig60 802.11ad with on-board antenna
Bluetooth : Bluetooth 5.0

Audio

Audio : 

  • Qualcomm® audio codec on-board
  • 1x US Standard CTIA Headset Jack
  • Analog audio input and output expansion headers

Mechanical Specifications

Dimensions (W x L x H) : 

  • Mini-ITX form-factor — 170mm x 170mm

OS Support

Android : 8.0

Electrical Specifications

Supply voltage : +12V Main Supply

Connectivity

SD : USD 3.0 UHS-1
USB : 

  • 2x USB2.0 Type-A host (on-board hub)
  • 1x USB micro-B UART
  • 1x USB3.1 Type-C with DisplayPort video out
Sensors : 

  • NFC expansion header, sensor expansion header, with I2C, SPI, UART, GPIO
GPS : 

  • GNSS daughter card with GPS, GLONASS, COMPASS, and Galileo, PCB antenna and SMA connector option

CPU

 

CPU Name :                Qualcomm Snapdragon™ SDA845
CPU Type : Kryo™ 385
CPU Cores : 8
CPU Clock (Max) : 2.80 GHz

System On Module

Carrier Board

Mezzanine Board

Memory

LPDDR4 : 6GB

UFS : UFS 2.1, 128GB

Multimedia

2D/3D Graphics Acceleration : Adreno™ 630 GPU

Video Encode :

  • Video Capture to 4K (3840×2160) Ultra HD at 60fps
  • HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps

Video Decode :

  • Video Playback to 4K (3840×2160) Ultra HD at 60fps
  • H.264 (AVC), H.265 (HEVC), VP9

Camera Interfaces :

  • 2x 16MP(@30fps ZSL) or 1x 32MP (@30fps ZSL) camera
  • 3x 4-lane + 1x 2-lane MIPI CSI ports

Display

DSI :

  • HDMI 1.4 via DSI -> HDMI bridge on board
  • Display Port over USB3.1 Type-C

HDMI :

  • HDMI 1.4 via 1X4 lane MIPI DSI;
  • HDMI bridge on board

Connectivity

SD : uSD 3.0 UHS-1

USB :

  • 2x USB2.0 Type-A host (on-board hub)
  • 1x USB micro-B UART
  • 1x USB3.1 Type-C with DisplayPort video out

Sensors : NFC expansion header, sensor expansion header, with I2C, SPI, UART, GPIO

GPS : GNSS daughter card with GPS, GLONASS, COMPASS, and Galileo, PCB antenna and SMA connector option

Networking

Wi-Fi :

  • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz, 2×2 MIMO
  • WiGig60 802.11ad with on-board antenna

Bluetooth : Bluetooth 5.0

Audio

Audio :

  • Qualcomm® audio codec on-board
  • 1x US Standard CTIA Headset Jack
  • Analog audio input and output expansion headers

OS Support

Android : 8.0

Mechanical Specifications

Dimensions (W x L x H) : Mini-ITX form-factor — 170mm x 170mm

Operating Environment

Electrical Specifications

Supply voltage : +12V Main Supply

Kit Details

Documentation

eInfochips 845 Technical Datasheet Download

eInfochips, an Arrow Electronics company, is a leading provider of digital transformation and product engineering services. eInfochips accelerates time to market for its customers with its expertise in IoT, AI/ML, security, sensors, silicon, wireless, cloud, and power. eInfochips has been recognized as a leader in Engineering R&D services by many top analysts and industry bodies, including Gartner, Zinnov, ISG, IDC, NASSCOM and others.

Headquarters
– USA, San Jose
– INDIA, Ahmedabad

Write to Us: marketing@eInfochips.com

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